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A multilayer fabrication technique f...

Caraffini, Simone.

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A multilayer fabrication technique for three-dimensional metallic microstructures.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A multilayer fabrication technique for three-dimensional metallic microstructures./
作者:	Caraffini, Simone.
面頁冊數:	98 p.
附註:	Source: Dissertation Abstracts International, Volume: 60-12, Section: B, page: 6322.
Contained By:	Dissertation Abstracts International60-12B.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9954884
ISBN:	0599580445

A multilayer fabrication technique for three-dimensional metallic microstructures.
Caraffini, Simone.

A multilayer fabrication technique for three-dimensional metallic microstructures. - 98 p.

Source: Dissertation Abstracts International, Volume: 60-12, Section: B, page: 6322.

Thesis (Ph.D.)--University of Illinois at Chicago, 1999.

A technique to fabricate three-dimensional metallic microstructures by electroforming into negative polyimide micromolds is defined in this work.

ISBN: 0599580445Subjects--Topical Terms:

783786
Engineering, Mechanical.

A multilayer fabrication technique for three-dimensional metallic microstructures.
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100 1 $a Caraffini, Simone. $3 1929603
245 1 2 $a A multilayer fabrication technique for three-dimensional metallic microstructures.
300 $a 98 p.
500 $a Source: Dissertation Abstracts International, Volume: 60-12, Section: B, page: 6322.
500 $a Adviser: James G. Boyd.
502 $a Thesis (Ph.D.)--University of Illinois at Chicago, 1999.
520 $a A technique to fabricate three-dimensional metallic microstructures by electroforming into negative polyimide micromolds is defined in this work.
520 $a The thesis is presented in three parts. First, an overview of the fabrication methods involved in this technique is reported.
520 $a Second, novel methods used for the fabrication of three-dimensional metallic structures are presented. The polyimide mold is created with UV-Iight lithography. After each polyimide application, metal is electroplated in the mold. By repeating these steps (micromolding and electroforming), a three-dimensional multilayer structure is obtained. The polyimide mold is removed at the end of the process, and the structure is released from its substrate. Properties and problems related to the photosensitive polyimide (such as reactivity with copper, moisture absorption, loss of adhesion, etc.) are addressed. Electroforming of nickel, copper and permalloy are discussed and optimised. In particular, a nickel activating solution is applied successfully for electroforming of microstructures. A shadow mask technique for seed-layer patterning is presented and discussed.
520 $a Third, a magnetically actuated microgripper is fabricated as an example device. Micro rippers are needed to assemble Micro Electro-Mechanical Systems (MEMS). The current microgripper consists of three ferromagnetic fingers for gripping held together by a nickel rim and bonded to a glass wafer containing an electromagnetic coil. The electromagnetic coil is made by electroforming copper into a photoresist mold in a standard manner. However, the fingers are made using a novel multi-layer fabrication technique in which: (1) one permalloy and nickel link of the finger is electroformed into a polyimide mold; (2) a new polyimide mold is spun onto the original mold, and a nickel joint is electroformed; (3) another polyimide mold is spun onto the joint layer, and the second link of the finger is electroformed.
520 $a This novel technique allows for fabrication of different numbers of fingers having different shapes, as well as scoops, shovels, etc. The gripper allows for out-of-plane motion and grasping of objects.
590 $a School code: 0799.
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Applied Mechanics. $3 1018410
650 4 $a Engineering, Electronics and Electrical. $3 626636
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710 2 0 $a University of Illinois at Chicago. $3 1020478
773 0 $t Dissertation Abstracts International $g 60-12B.
790 1 0 $a Boyd, James G., $e advisor
790 $a 0799
791 $a Ph.D.
792 $a 1999
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9954884