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A thermodynamic field formulation fo...

Enikov, Eniko Todorov.

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A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS).

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS)./
作者:	Enikov, Eniko Todorov.
面頁冊數:	128 p.
附註:	Source: Dissertation Abstracts International, Volume: 59-12, Section: B, page: 6373.
Contained By:	Dissertation Abstracts International59-12B.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9914987
ISBN:	0599136979

A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS).
Enikov, Eniko Todorov.

A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS). - 128 p.

Source: Dissertation Abstracts International, Volume: 59-12, Section: B, page: 6373.

Thesis (Ph.D.)--University of Illinois at Chicago, 1998.

An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. Global integral equations are written for the conservation of mass, momentum, and energy, Maxwell's equations, and the second law of thermodynamics. The global equations are then localized in the volume, the material surfaces, and the nonmaterial bond line. The second law is used to determine the thermodynamic conjugates in the thermodynamic potential and the dissipation inequality. It is demonstrated that the jump in the Poynting vector across a surface is equal to the surface Joule heating due to surface electric conduction currents.

ISBN: 0599136979Subjects--Topical Terms:

783786
Engineering, Mechanical.

A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS).
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245 1 2 $a A thermodynamic field formulation for anodic bonding of microelectromechanical systems (MEMS).
300 $a 128 p.
500 $a Source: Dissertation Abstracts International, Volume: 59-12, Section: B, page: 6373.
500 $a Adviser: James Boyd.
502 $a Thesis (Ph.D.)--University of Illinois at Chicago, 1998.
520 $a An anodic bond is modeled as a moving nonmaterial line forming the intersection of three material surfaces representing the unbonded conductor, the unbonded insulator, and the bonded interface. Global integral equations are written for the conservation of mass, momentum, and energy, Maxwell's equations, and the second law of thermodynamics. The global equations are then localized in the volume, the material surfaces, and the nonmaterial bond line. The second law is used to determine the thermodynamic conjugates in the thermodynamic potential and the dissipation inequality. It is demonstrated that the jump in the Poynting vector across a surface is equal to the surface Joule heating due to surface electric conduction currents.
520 $a A finite element code was written to solve the governing equations in 2D. The electrostatic body forces are accounted through the Maxwell's stress tensor. One-dimensional boundary elements are used to insure the boundary continuity of total electro-mechanical and electrostatic flux across the bond interface.
520 $a It is shown that a field formulation of anodic bonding allows for prediction of its effects on the overall structure of a MEMS, including thermoelastic residual stresses, space charge retention and deformation due to creep of the glass.
590 $a School code: 0799.
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Applied Mechanics. $3 1018410
650 4 $a Engineering, Electronics and Electrical. $3 626636
650 4 $a Engineering, Materials Science. $3 1017759
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710 2 0 $a University of Illinois at Chicago. $3 1020478
773 0 $t Dissertation Abstracts International $g 59-12B.
790 1 0 $a Boyd, James, $e advisor
790 $a 0799
791 $a Ph.D.
792 $a 1998
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