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Growth and characterization of high ...
~
Patel, Zubin P.
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Growth and characterization of high dielectric constant material for nanoscale device applications.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Growth and characterization of high dielectric constant material for nanoscale device applications./
作者:
Patel, Zubin P.
面頁冊數:
173 p.
附註:
Source: Dissertation Abstracts International, Volume: 65-05, Section: B, page: 2449.
Contained By:
Dissertation Abstracts International65-05B.
標題:
Physics, General. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3132848
ISBN:
0496800886
Growth and characterization of high dielectric constant material for nanoscale device applications.
Patel, Zubin P.
Growth and characterization of high dielectric constant material for nanoscale device applications.
- 173 p.
Source: Dissertation Abstracts International, Volume: 65-05, Section: B, page: 2449.
Thesis (Ph.D.)--State University of New York at Albany, 2004.
The need for nanoscale devices to perform at greater speed is the key element driving the scaling down of devices. Silicon dioxide has been the material choice as dielectric for more than 30 years. Decreasing the dielectric thickness of silicon dioxide is reaching several fundamental limitations. This is causing a concern to the use of silicon dioxide as a dielectric material. The search for a new high-dielectric material within the required time frame has been proven challenging. This puts increasing demands on integrated chip technology requiring exploration of novel materials, deposition techniques and characterization methods.
ISBN: 0496800886Subjects--Topical Terms:
1018488
Physics, General.
Growth and characterization of high dielectric constant material for nanoscale device applications.
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Source: Dissertation Abstracts International, Volume: 65-05, Section: B, page: 2449.
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Thesis (Ph.D.)--State University of New York at Albany, 2004.
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The need for nanoscale devices to perform at greater speed is the key element driving the scaling down of devices. Silicon dioxide has been the material choice as dielectric for more than 30 years. Decreasing the dielectric thickness of silicon dioxide is reaching several fundamental limitations. This is causing a concern to the use of silicon dioxide as a dielectric material. The search for a new high-dielectric material within the required time frame has been proven challenging. This puts increasing demands on integrated chip technology requiring exploration of novel materials, deposition techniques and characterization methods.
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This work done is divided into two phases, (1) Development and optimization of tantalum oxide film for nanoscale device applications. (2) Establishing and verifying the detection limits of non-Rutherford elastic back scattering for the quantification of trace amount of carbon in thin films.
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In the first phase, this thesis focuses on process development and optimization of low pressure chemical vapor deposition process for tantalum oxide films grown on silicon. Optimization was focused on obtaining desired stoichiometry, maximizing the film density and minimizing impurities such as carbon and hydrogen in thin films. The discussion includes the effect of the annealing ambient environments in reducing the carbon and hydrogen content and the resulting effect on the electrical properties.
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For quantification of carbon as trace impurity or a dopant within a high Z material matrix, the second phase of the thesis focuses on establishing and verifying the detection limits of non-Rutherford elastic backscattering. Compared to conventional sputtering techniques this technique is capable of providing trace carbon concentration information at various depths, nondestructively.
520
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Previous published works on this non-Rutherford response have not identified the minimum detection levels. With an interest in low concentrations of carbon, we undertook to define the limits of detection for this technique. The potential of the method is illustrated by determining changes in trace carbon content in MOCVD (Metal Organic CVD) grown Ta2O5 due to different annealing ambient. The results are coupled with electrical data to co-relate the findings.
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