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Nodal topology in compact thermal mo...

Greisen, Daniel H.

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Nodal topology in compact thermal models.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Nodal topology in compact thermal models./
作者:	Greisen, Daniel H.
面頁冊數:	93 p.
附註:	Source: Masters Abstracts International, Volume: 45-02, page: 1044.
Contained By:	Masters Abstracts International45-02.
標題:	Engineering, Mechanical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1440217

Nodal topology in compact thermal models.
Greisen, Daniel H.

Nodal topology in compact thermal models. - 93 p.

Source: Masters Abstracts International, Volume: 45-02, page: 1044.

Thesis (M.S.)--Tufts University, 2007.

BCI Compact Thermal Models (CTMs) predict the thermal behavior of an integrated circuit package with less computational effort than a fully-discretized model. It is often necessary to subdivide the package surfaces into multiple nodes because of heat flux non-uniformities. CTMs are developed for TQFP and BGA packages using the Bosch and Sabry method. CTM performance sensitivity to area ratio changes is discussed. The impact of generating heat transfer coefficients is addressed. The optimum area ratio for each package was compared to the package surface heat flux profile but no correlation was found. An unexpected result was that CTM performance was sensitive to changes in the generating heat transfer coefficient. A critical generating heat transfer coefficient was determined such that the resulting CTM was optimized for a single boundary condition but was accurate for all boundary conditions. The single boundary condition also provides an upper bound for error.Subjects--Topical Terms:

783786
Engineering, Mechanical.

Nodal topology in compact thermal models.
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100 1 $a Greisen, Daniel H. $3 1923291
245 1 0 $a Nodal topology in compact thermal models.
300 $a 93 p.
500 $a Source: Masters Abstracts International, Volume: 45-02, page: 1044.
500 $a Adviser: V. P. Manno.
502 $a Thesis (M.S.)--Tufts University, 2007.
520 $a BCI Compact Thermal Models (CTMs) predict the thermal behavior of an integrated circuit package with less computational effort than a fully-discretized model. It is often necessary to subdivide the package surfaces into multiple nodes because of heat flux non-uniformities. CTMs are developed for TQFP and BGA packages using the Bosch and Sabry method. CTM performance sensitivity to area ratio changes is discussed. The impact of generating heat transfer coefficients is addressed. The optimum area ratio for each package was compared to the package surface heat flux profile but no correlation was found. An unexpected result was that CTM performance was sensitive to changes in the generating heat transfer coefficient. A critical generating heat transfer coefficient was determined such that the resulting CTM was optimized for a single boundary condition but was accurate for all boundary conditions. The single boundary condition also provides an upper bound for error.
590 $a School code: 0234.
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0548
690 $a 0549
710 2 0 $a Tufts University. $3 1017847
773 0 $t Masters Abstracts International $g 45-02.
790 1 0 $a Manno, V. P., $e advisor
790 $a 0234
791 $a M.S.
792 $a 2007
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1440217