東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back

Switch To: Labeled | MARC Mode | ISBD

Nodal topology in compact thermal mo...

Greisen, Daniel H.

Linked to FindBook

Google Book

Amazon

博客來

Nodal topology in compact thermal models.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Nodal topology in compact thermal models./
Author:	Greisen, Daniel H.
Description:	93 p.
Notes:	Source: Masters Abstracts International, Volume: 45-02, page: 1044.
Contained By:	Masters Abstracts International45-02.
Subject:	Engineering, Mechanical. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1440217

Nodal topology in compact thermal models.
Greisen, Daniel H.

Nodal topology in compact thermal models. - 93 p.

Source: Masters Abstracts International, Volume: 45-02, page: 1044.

Thesis (M.S.)--Tufts University, 2007.

BCI Compact Thermal Models (CTMs) predict the thermal behavior of an integrated circuit package with less computational effort than a fully-discretized model. It is often necessary to subdivide the package surfaces into multiple nodes because of heat flux non-uniformities. CTMs are developed for TQFP and BGA packages using the Bosch and Sabry method. CTM performance sensitivity to area ratio changes is discussed. The impact of generating heat transfer coefficients is addressed. The optimum area ratio for each package was compared to the package surface heat flux profile but no correlation was found. An unexpected result was that CTM performance was sensitive to changes in the generating heat transfer coefficient. A critical generating heat transfer coefficient was determined such that the resulting CTM was optimized for a single boundary condition but was accurate for all boundary conditions. The single boundary condition also provides an upper bound for error.Subjects--Topical Terms:

783786
Engineering, Mechanical.

Nodal topology in compact thermal models.
LDR:01758nmm 2200265 4500 001 1834651
005 20071127115003.5
008 130610s2007 eng d
035 $a (UMI)AAI1440217
035 $a AAI1440217
040 $a UMI $c UMI
100 1 $a Greisen, Daniel H. $3 1923291
245 1 0 $a Nodal topology in compact thermal models.
300 $a 93 p.
500 $a Source: Masters Abstracts International, Volume: 45-02, page: 1044.
500 $a Adviser: V. P. Manno.
502 $a Thesis (M.S.)--Tufts University, 2007.
520 $a BCI Compact Thermal Models (CTMs) predict the thermal behavior of an integrated circuit package with less computational effort than a fully-discretized model. It is often necessary to subdivide the package surfaces into multiple nodes because of heat flux non-uniformities. CTMs are developed for TQFP and BGA packages using the Bosch and Sabry method. CTM performance sensitivity to area ratio changes is discussed. The impact of generating heat transfer coefficients is addressed. The optimum area ratio for each package was compared to the package surface heat flux profile but no correlation was found. An unexpected result was that CTM performance was sensitive to changes in the generating heat transfer coefficient. A critical generating heat transfer coefficient was determined such that the resulting CTM was optimized for a single boundary condition but was accurate for all boundary conditions. The single boundary condition also provides an upper bound for error.
590 $a School code: 0234.
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Engineering, Packaging. $3 1025152
690 $a 0548
690 $a 0549
710 2 0 $a Tufts University. $3 1017847
773 0 $t Masters Abstracts International $g 45-02.
790 1 0 $a Manno, V. P., $e advisor
790 $a 0234
791 $a M.S.
792 $a 2007
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1440217