語系:
繁體中文
English
說明(常見問題)
回圖書館首頁
手機版館藏查詢
登入
回首頁
切換:
標籤
|
MARC模式
|
ISBD
Study of key integration challenges ...
~
Worsley, Marcus Andre.
FindBook
Google Book
Amazon
博客來
Study of key integration challenges for low-kappa materials in integrated circuit fabrication.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Study of key integration challenges for low-kappa materials in integrated circuit fabrication./
作者:
Worsley, Marcus Andre.
面頁冊數:
229 p.
附註:
Source: Dissertation Abstracts International, Volume: 67-09, Section: B, page: 5347.
Contained By:
Dissertation Abstracts International67-09B.
標題:
Engineering, Chemical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3235378
ISBN:
9780542896156
Study of key integration challenges for low-kappa materials in integrated circuit fabrication.
Worsley, Marcus Andre.
Study of key integration challenges for low-kappa materials in integrated circuit fabrication.
- 229 p.
Source: Dissertation Abstracts International, Volume: 67-09, Section: B, page: 5347.
Thesis (Ph.D.)--Stanford University, 2006.
There is a need to adopt novel low-kappa materials as inter-level-dielectrics (ILDs) in future technology generations. The current challenge is to design low-kappa materials with sufficient mechanical and chemical stability such that they can be easily integrated into current fabrication schemes. Toward this end, this thesis seeks to address two main issues that slow the implementation of low-kappa ILDs, which include (1) chemical stability in ash plasmas and (2) mechanical strength of porous films.
ISBN: 9780542896156Subjects--Topical Terms:
1018531
Engineering, Chemical.
Study of key integration challenges for low-kappa materials in integrated circuit fabrication.
LDR
:03332nmm 2200313 4500
001
1832108
005
20070628102715.5
008
130610s2006 eng d
020
$a
9780542896156
035
$a
(UnM)AAI3235378
035
$a
AAI3235378
040
$a
UnM
$c
UnM
100
1
$a
Worsley, Marcus Andre.
$3
1920853
245
1 0
$a
Study of key integration challenges for low-kappa materials in integrated circuit fabrication.
300
$a
229 p.
500
$a
Source: Dissertation Abstracts International, Volume: 67-09, Section: B, page: 5347.
500
$a
Adviser: Stacey Bent.
502
$a
Thesis (Ph.D.)--Stanford University, 2006.
520
$a
There is a need to adopt novel low-kappa materials as inter-level-dielectrics (ILDs) in future technology generations. The current challenge is to design low-kappa materials with sufficient mechanical and chemical stability such that they can be easily integrated into current fabrication schemes. Toward this end, this thesis seeks to address two main issues that slow the implementation of low-kappa ILDs, which include (1) chemical stability in ash plasmas and (2) mechanical strength of porous films.
520
$a
To address the issue of chemical stability, the interactions between plasmas and organosilicate glass (OSG) low-kappa materials that lead to modification were investigated. This work revealed several factors that influence modification in O2, H2, and N2 ash plasmas using various techniques. Using blanket films and techniques such as spectroscopic ellipsometry, x-ray photoelectron spectroscopy (XPS), and infrared spectroscopy, damage to OSG films were correlated with porosity, plasma species, and substrate temperature. Key results from this study were that porous films are much more susceptible to modification than dense films and modification in H2 ash plasmas was highly dependent upon substrate temperature. Less modification occurred at elevated temperatures. In a patterned film study, optical emission (OE) actinometry was used to measure the absolute densities of reactive radical species, and modeling of various plasma parameters (sheath thickness and positive ion mean free path) was used to estimate the significance of ion scattering in several ashing plasmas. Patterned films were ashed in conditions identical to that characterized and then analyzed using angle-resolved XPS (ARXPS). Data from the OE actinometry and modeling were combined with the ARXPS data to identify key factors that influence modification of the OSG. The key result from this study was that ion bombardment, rather than radical species density, played a dominant role in the modification process.
520
$a
In addition, to address the issue of mechanical strength in porous low-kappa materials, a new low-kappa candidate, oxycarbosiliane (OCS) films, was investigated. OCS films have been shown to have significantly higher (up to 5x) elastic moduli than OSG films. Preliminary results showing how aging and cure conditions impact OCS mechanical strength and other film properties are presented.
590
$a
School code: 0212.
650
4
$a
Engineering, Chemical.
$3
1018531
650
4
$a
Physics, Fluid and Plasma.
$3
1018402
650
4
$a
Engineering, Materials Science.
$3
1017759
690
$a
0542
690
$a
0759
690
$a
0794
710
2 0
$a
Stanford University.
$3
754827
773
0
$t
Dissertation Abstracts International
$g
67-09B.
790
1 0
$a
Bent, Stacey,
$e
advisor
790
$a
0212
791
$a
Ph.D.
792
$a
2006
856
4 0
$u
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3235378
筆 0 讀者評論
館藏地:
全部
電子資源
出版年:
卷號:
館藏
1 筆 • 頁數 1 •
1
條碼號
典藏地名稱
館藏流通類別
資料類型
索書號
使用類型
借閱狀態
預約狀態
備註欄
附件
W9222971
電子資源
11.線上閱覽_V
電子書
EB
一般使用(Normal)
在架
0
1 筆 • 頁數 1 •
1
多媒體
評論
新增評論
分享你的心得
Export
取書館
處理中
...
變更密碼
登入