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A low-cost short-distance thermal co...
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Ma, Yan.
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A low-cost short-distance thermal conduction pressure sensor.
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
A low-cost short-distance thermal conduction pressure sensor./
作者:
Ma, Yan.
面頁冊數:
108 p.
附註:
Source: Masters Abstracts International, Volume: 44-01, page: 0530.
Contained By:
Masters Abstracts International44-01.
標題:
Engineering, Mechanical. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=MR03510
ISBN:
9780494035108
A low-cost short-distance thermal conduction pressure sensor.
Ma, Yan.
A low-cost short-distance thermal conduction pressure sensor.
- 108 p.
Source: Masters Abstracts International, Volume: 44-01, page: 0530.
Thesis (M.A.Sc.)--Simon Fraser University (Canada), 2005.
A low-cost thermal pressure sensor based on short-distance thermal conduction and used in atmospheric pressure range has been explored. This simple device consists of a heater made of a polysilicon resistor, a heat sink made by the silicon substrate and a tiny air gap between them. With innovative ideas and simple processes, the gap can be made in the order of nanometers inexpensively, which significantly increases the measurement range of the sensor. Devices capable of measuring 700kPa (7atm) or more have been fabricated with a 3-mask, 3mum and CMOS compatible process. The device can be made as small as 50 x 50mum2, less than the size of a standard bonding pad. The simple process and low cost associated with these devices could make commercial adaptation promising.
ISBN: 9780494035108Subjects--Topical Terms:
783786
Engineering, Mechanical.
A low-cost short-distance thermal conduction pressure sensor.
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A low-cost thermal pressure sensor based on short-distance thermal conduction and used in atmospheric pressure range has been explored. This simple device consists of a heater made of a polysilicon resistor, a heat sink made by the silicon substrate and a tiny air gap between them. With innovative ideas and simple processes, the gap can be made in the order of nanometers inexpensively, which significantly increases the measurement range of the sensor. Devices capable of measuring 700kPa (7atm) or more have been fabricated with a 3-mask, 3mum and CMOS compatible process. The device can be made as small as 50 x 50mum2, less than the size of a standard bonding pad. The simple process and low cost associated with these devices could make commercial adaptation promising.
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