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Solutions for emerging problems in m...

Xu, Qiang.

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Solutions for emerging problems in modular system-on-a-chip testing.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Solutions for emerging problems in modular system-on-a-chip testing./
作者:	Xu, Qiang.
面頁冊數:	211 p.
附註:	Source: Dissertation Abstracts International, Volume: 66-10, Section: B, page: 5602.
Contained By:	Dissertation Abstracts International66-10B.
標題:	Engineering, Electronics and Electrical. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=NR07950
ISBN:	9780494079508

Solutions for emerging problems in modular system-on-a-chip testing.
Xu, Qiang.

Solutions for emerging problems in modular system-on-a-chip testing. - 211 p.

Source: Dissertation Abstracts International, Volume: 66-10, Section: B, page: 5602.

Thesis (Ph.D.)--McMaster University (Canada), 2005.

Manufacturing test has established itself as an enabling technology for the system-on-achip (SOC) design paradigm. Although the IEEE Std. 1500 for embedded core test and prior work on test access mechanism design ease the SOC testing process, there are several emerging problems not treated explicitly or cost-effectively by the state-of-the-art methods. For example, the number of clock domains is stepping-up and the specific test access and isolation problems posed by multi-frequency cores have not been treated explicitly; detection of timing failures, which are predominant in deep sub-micron technologies, requires support from the test access architectures for at-speed application of two successive patterns; glue logic defined by system integrators for product differentiation is increasing in size and its test can adversely influence either the chip area or testing time; the continuous growth in the size of SOCs leads to multiple levels of design hierarchy, which imposes an additional constraint on the design and reuse of test architectures.

ISBN: 9780494079508Subjects--Topical Terms:

626636
Engineering, Electronics and Electrical.

Solutions for emerging problems in modular system-on-a-chip testing.
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500 $a Source: Dissertation Abstracts International, Volume: 66-10, Section: B, page: 5602.
502 $a Thesis (Ph.D.)--McMaster University (Canada), 2005.
520 $a Manufacturing test has established itself as an enabling technology for the system-on-achip (SOC) design paradigm. Although the IEEE Std. 1500 for embedded core test and prior work on test access mechanism design ease the SOC testing process, there are several emerging problems not treated explicitly or cost-effectively by the state-of-the-art methods. For example, the number of clock domains is stepping-up and the specific test access and isolation problems posed by multi-frequency cores have not been treated explicitly; detection of timing failures, which are predominant in deep sub-micron technologies, requires support from the test access architectures for at-speed application of two successive patterns; glue logic defined by system integrators for product differentiation is increasing in size and its test can adversely influence either the chip area or testing time; the continuous growth in the size of SOCs leads to multiple levels of design hierarchy, which imposes an additional constraint on the design and reuse of test architectures.
520 $a This dissertation shows how at-speed test application, without test hazards, can be achieved for cores with multiple clock domains, by embedding small custom logic in the wrapper. It also introduces novel test architectures for SOCs containing unwrapped logic blocks without any loss in fault coverage, by combining dedicated bus-based test access mechanism and functional interconnects for test data transfer. With some minor changes, this new test architecture can be utilized to effectively apply two-pattern test for core-based SOCs, which is essential for detecting delay faults and CMOS stuck-open faults. Test access mechanism design algorithms for the new SOC test architectures are also proposed and design trade-offs between test area and testing time are discussed. Finally, this dissertation presents a new framework for the design space exploration of multi-level test access mechanisms, which is important for future hierarchical SOCs that reuse past-generation SOCs with existing test infrastructure as internal mega-cores.
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