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Deformability of thin films of elect...

Li, Teng.

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Deformability of thin films of electronic materials on polymer substrates.

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Deformability of thin films of electronic materials on polymer substrates./
作者:	Li, Teng.
面頁冊數:	114 p.
附註:	Source: Dissertation Abstracts International, Volume: 67-02, Section: B, page: 0970.
Contained By:	Dissertation Abstracts International67-02B.
標題:	Applied Mechanics. -
電子資源:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3205924
ISBN:	9780542547133

Deformability of thin films of electronic materials on polymer substrates.
Li, Teng.

Deformability of thin films of electronic materials on polymer substrates. - 114 p.

Source: Dissertation Abstracts International, Volume: 67-02, Section: B, page: 0970.

Thesis (Ph.D.)--Harvard University, 2006.

While the microelectronics technology advances by miniaturizing features, progress on enlarging system scale gives rise to a nascent field known as macroelectronics. Diverse applications are emerging, i.e., rollable display, electronic skin and printable solar-cell. Desired attributes of macroelectronics include flexibility, ruggedness and low-cost, which will come from new material choices, i.e., organic/inorganic hybrids. While some organic materials can recover from large deformation, thin films of most electronic materials, such as metals, dielectrics and semiconductors, fracture at small strains (less than &sim;1%). How to use these materials to make flexible devices remains a challenge. This thesis studies the deformation behavior of thin films of electronic materials on polymer substrates and explores possible mechanisms to enhance the deformability of these films.

ISBN: 9780542547133Subjects--Topical Terms:

1018410
Applied Mechanics.

Deformability of thin films of electronic materials on polymer substrates.
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245 1 0 $a Deformability of thin films of electronic materials on polymer substrates.
300 $a 114 p.
500 $a Source: Dissertation Abstracts International, Volume: 67-02, Section: B, page: 0970.
500 $a Adviser: Zhigang Suo.
502 $a Thesis (Ph.D.)--Harvard University, 2006.
520 $a While the microelectronics technology advances by miniaturizing features, progress on enlarging system scale gives rise to a nascent field known as macroelectronics. Diverse applications are emerging, i.e., rollable display, electronic skin and printable solar-cell. Desired attributes of macroelectronics include flexibility, ruggedness and low-cost, which will come from new material choices, i.e., organic/inorganic hybrids. While some organic materials can recover from large deformation, thin films of most electronic materials, such as metals, dielectrics and semiconductors, fracture at small strains (less than &sim;1%). How to use these materials to make flexible devices remains a challenge. This thesis studies the deformation behavior of thin films of electronic materials on polymer substrates and explores possible mechanisms to enhance the deformability of these films.
520 $a The thesis first focuses on the tensile deformation of thin metal films on polymer substrates. Under tension, a freestanding thin metal film usually ruptures by strain localization, i.e., necking, at a small strain. By volume conservation, local thinning results in a local elongation. While the local elongation is accommodated for the freestanding metal film by the ruptured halves moving apart, it cannot be so accommodated for a metal film bonded to a substrate. Using bifurcation analysis and finite element simulation, we have shown that a sufficiently stiff substrate can retard strain localization and significantly elevate the rupture strain of a metal film. If the metal/polymer interface debonds, however, the film becomes freestanding and ruptures at a smaller strain. Using a cohesive zone model, we simulate the co-evolution of interfacial debonding and film necking, through which we identify and quantify the adhesion parameters governing the rupture strain. The thesis then broadens the focus onto general electronic materials and explores possible ways to enhance their deformability. We have shown that a thin film of a stiff material, suitably patterned on a sufficiently compliant substrate, elongates by deflecting and twisting out-of-plane, so that large elongations of the substrate induce small strains in the film. We propose that such patterned films can serve as platforms, on which entire electronic circuits can be fabricated. These circuits will function without appreciable fatigue when the substrate is repeatedly bent, twisted, and stretched.
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