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Ultra-thin chip technology and appli...

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Burghartz, Joachim N.

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Ultra-thin chip technology and applications

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Ultra-thin chip technology and applications/ edited by Joachim N. Burghartz.{me_controlnum}
其他作者:	Burghartz, Joachim N.
出版者:	New York, NY :Springer Science+Business Media, LLC, : 2011.,
面頁冊數:	xxii, 467 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Integrated circuits - Wafer-scale integration. -
電子資源:	http://dx.doi.org/10.1007/978-1-4419-7276-7
ISBN:	9781441972767 (electronic bk.)

Ultra-thin chip technology and applications
Ultra-thin chip technology and applications[electronic resource] /edited by Joachim N. Burghartz.{me_controlnum} - New York, NY :Springer Science+Business Media, LLC,2011. - xxii, 467 p. :ill., digital ;24 cm.

ISBN: 9781441972767 (electronic bk.)Subjects--Topical Terms:

1036502
Integrated circuits
--Wafer-scale integration.

LC Class. No.: TK7874 / .U48 2011

Dewey Class. No.: 621.3815

Ultra-thin chip technology and applications
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020 $a 9781441972750 (paper)
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050 0 4 $a TK7874 $b .U48 2011
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245 0 0 $a Ultra-thin chip technology and applications $h [electronic resource] / $c edited by Joachim N. Burghartz.{me_controlnum}
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300 $a xxii, 467 p. : $b ill., digital ; $c 24 cm.
650 0 $a Integrated circuits $x Wafer-scale integration. $3 1036502
650 0 $a Integrated circuits $x Wafer-scale integration $x Design and construction. $3 1531298
650 1 4 $a Engineering. $3 586835
650 2 4 $a Circuits and Systems. $3 896527
650 2 4 $a Computer-Aided Engineering (CAD, CAE) and Design. $3 892568
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773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-7276-7
950 $a Engineering (Springer-11647)

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