Covers
Xiao, Ying.
Overview
| Works: | 0 works in 0 publications in 0 languages | |
|---|---|---|
Titles
Integrated flip -chip flex -circuit packaging for power electronics applications.
by:
Xiao, Ying.; Rensselaer Polytechnic Institute.
(Electronic resources)
More than a mass noise!?: Popular music and polyphonic soundscapes in postsocialist Chinese cinema, media, and culture.
by:
Xiao, Ying.; New York University., Cinema Studies.
(Language materials, printed)
A Feasibility Study: Exploring Design Using BIM-Based Virtual Reality.
by:
Xiao, Ying.; University of Washington., Architecture.
(Electronic resources)