語系: 繁體中文

說明(常見問題)

回圖書館首頁

手機版館藏查詢

登入

語系

英文 (1)

跳至 : 概要 | 書目資訊 | 主題

Noia, Brandon.

概要

作品:	0 作品在 1 項出版品 1 種語言

書目資訊

Design-for-test and test optimization techniques for TSV-based 3D stacked ICs by: Noia, Brandon.; Chakrabarty, Krishnendu.; SpringerLink (Online service) (書目-電子資源)

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. by: Noia, Brandon.; Duke University., Electrical and Computer Engineering. (書目-電子資源)

主題

Semiconductors. Three-dimensional integrated circuits- Testing. Processor Architectures. Engineering, Computer. Three-dimensional integrated circuits- Design and construction. Circuits and Systems. Engineering. Engineering, Electronics and Electrical.

變更密碼

登入