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Tong, Xingcun Colin.{me_controlnum}

概要

作品:	2 作品在 0 項出版品 0 種語言

書目資訊

Advanced materials for thermal management of electronic packaging by: Tong, Xingcun Colin.{me_controlnum}; SpringerLink (Online service) (書目-電子資源)

主題

Electronics and Microelectronics, Instrumentation. Electronic packaging. Materials. Physics. Optical and Electronic Materials. Engineering Thermodynamics, Heat and Mass Transfer. Electronic Circuits and Devices.

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