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Tong, Xingcun Colin.{me_controlnum}

Overview

Works:	2 works in 0 publications in 0 languages

Titles

Advanced materials for thermal management of electronic packaging by: Tong, Xingcun Colin.{me_controlnum}; SpringerLink (Online service) (Electronic resources)

Subjects

Electronics and Microelectronics, Instrumentation. Electronic packaging. Materials. Physics. Optical and Electronic Materials. Engineering Thermodynamics, Heat and Mass Transfer. Electronic Circuits and Devices.

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