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Advanced materials for thermal manag...

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Tong, Xingcun Colin.{me_controlnum}

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Advanced materials for thermal management of electronic packaging

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Advanced materials for thermal management of electronic packaging/ by Xingcun Colin Tong.
作者:	Tong, Xingcun Colin.{me_controlnum}
出版者:	New York, NY :Springer Springer Science+Business Media, LLC, : 2011.,
面頁冊數:	xxi, 606 p. :ill. (some col.), digital ;24 cm.
叢書名:	Springer series in advanced microelectronics,
Contained By:	Springer eBooks
標題:	Electronic packaging. -
電子資源:	http://dx.doi.org/10.1007/978-1-4419-7759-5
ISBN:	9781441977595 (electronic bk.)

Advanced materials for thermal management of electronic packaging
Tong, Xingcun Colin.{me_controlnum}

Advanced materials for thermal management of electronic packaging[electronic resource] /by Xingcun Colin Tong. - New York, NY :Springer Springer Science+Business Media, LLC,2011. - xxi, 606 p. :ill. (some col.), digital ;24 cm. - Springer series in advanced microelectronics,301437-0387 ;.

ISBN: 9781441977595 (electronic bk.)Subjects--Topical Terms:

649666
Electronic packaging.

LC Class. No.: TK7870.15 / .T66 2011

Dewey Class. No.: 621.381046

Advanced materials for thermal management of electronic packaging
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020 $a 9781441977588 (paper)
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245 1 0 $a Advanced materials for thermal management of electronic packaging $h [electronic resource] / $c by Xingcun Colin Tong.
260 $a New York, NY : $b Springer Springer Science+Business Media, LLC, $c 2011.
300 $a xxi, 606 p. : $b ill. (some col.), digital ; $c 24 cm.
440 0 $a Springer series in advanced microelectronics, $x 1437-0387 ; $v 30
650 0 $a Electronic packaging. $3 649666
650 0 $a Materials. $3 556501
650 1 4 $a Physics. $3 516296
650 2 4 $a Electronic Circuits and Devices. $3 1245773
650 2 4 $a Optical and Electronic Materials. $3 891120
650 2 4 $a Engineering Thermodynamics, Heat and Mass Transfer. $3 1002079
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-7759-5
950 $a Engineering (Springer-11647)

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