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書目資訊
主題
Electronic packaging.
概要
作品:
17 作品在 4 項出版品 4 種語言
書目資訊
Surface mount technology for concurrent engineering and manufacturing /
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(書目-語言資料,印刷品)
Physical architecture of VLSI systems /
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(書目-語言資料,印刷品)
Circuits, interconnections, and packaging for VLSI /
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(書目-語言資料,印刷品)
Advanced materials for thermal management of electronic packaging
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(書目-電子資源)
Thin film technology handbook /
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(書目-語言資料,印刷品)
Boundary-scan interconnect diagnosis
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(書目-電子資源)
Electrical conductive adhesives with nanotechnologies
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(書目-語言資料,印刷品)
Encyclopedia of thermal packaging.. Set 1,. Thermal packaging techniques
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(書目-電子資源)
Nano-bio-electronic, photonic and MEMS packaging
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(書目-電子資源)
Packaging of high power semiconductor lasers
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(書目-電子資源)
Embedded cooling of electronic devices = conduction, evaporation, and single- and two-phase convection /
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(書目-電子資源)
The Basics of soldering /
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(書目-語言資料,印刷品)
Lead-free soldering in electronics : = science, technology and environmental impact /
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(書目-語言資料,印刷品)
Boundary-scan interconnect diagnosis
by:
(書目-語言資料,印刷品)
Nano-bio-electronic, photonic and MEMS packaging
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(書目-語言資料,印刷品)
Power electronic packaging = design, assembly process, reliability and modeling /
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(書目-電子資源)
更多
較少的
主題
Concurrent engineering.
Integrated circuits- Very large scale integration
Nanostructured materials.
Chemistry.
Biophysics and Biological Physics.
Solid State Physics.
Solder and soldering.
Boundary scan testing.
Bioelectronics.
Nanotechnology.
Biomedical Engineering.
Adhesives- Electric properties.
Semiconductor lasers.
Energy Systems.
Biomedical Engineering and Bioengineering.
Electronics and Microelectronics, Instrumentation.
Integrated circuits- Very large scale integration.
Electronic apparatus and appliances- Testing.
Nanophotonics.
Spectroscopy and Microscopy.
Electronic apparatus and appliances- Cooling.
Electric contacts- Testing.
Electrochemistry.
Circuits and Systems.
Materials Science, general.
Power Electronics, Electrical Machines and Networks.
Energy Harvesting.
Electronic packaging.
Power electronics.
Insulation (Heat)
Energy.
Microfluidic devices.
Surface mount technology.
Thin film devices- Design and construction.
Thin films.
Engineering.
Optical and Electronic Materials.
Materials.
Physics.
Engineering Thermodynamics, Heat and Mass Transfer.
Heat- Conduction.
Heat- Convection.
Electronic Circuits and Devices.
處理中
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