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Electronic packaging.

概要

作品:	16 作品在 3 項出版品 3 種語言

書目資訊

Surface mount technology for concurrent engineering and manufacturing / by: (書目-語言資料,印刷品)

Physical architecture of VLSI systems / by: (書目-語言資料,印刷品)

Circuits, interconnections, and packaging for VLSI / by: (書目-語言資料,印刷品)

Boundary-scan interconnect diagnosis by: (書目-語言資料,印刷品)

Nano-bio-electronic, photonic and MEMS packaging by: (書目-語言資料,印刷品)

Encyclopedia of thermal packaging.. Set 1,. Thermal packaging techniques by: (書目-電子資源)

Nano-bio-electronic, photonic and MEMS packaging by: (書目-電子資源)

Thin film technology handbook / by: (書目-語言資料,印刷品)

The Basics of soldering / by: (書目-語言資料,印刷品)

Lead-free soldering in electronics : = science, technology and environmental impact / by: (書目-語言資料,印刷品)

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主題

Concurrent engineering.

Integrated circuits- Very large scale integration

Nanostructured materials.

Chemistry.

Biophysics and Biological Physics.

Solid State Physics.

Solder and soldering.

Boundary scan testing.

Bioelectronics.

Nanotechnology.

Biomedical Engineering.

Adhesives- Electric properties.

Semiconductor lasers.

Energy Systems.

Biomedical Engineering and Bioengineering.

Electronics and Microelectronics, Instrumentation.

Integrated circuits- Very large scale integration.

Electronic apparatus and appliances- Testing.

Spectroscopy and Microscopy.

Electric contacts- Testing.

Electrochemistry.

Circuits and Systems.

Materials Science, general.

Power Electronics, Electrical Machines and Networks.

Energy Harvesting.

Electronic packaging.

Power electronics.

Insulation (Heat)

Energy.

Surface mount technology.

Thin film devices- Design and construction.

Optical and Electronic Materials.

Materials.

Physics.

Engineering Thermodynamics, Heat and Mass Transfer.

Electronic Circuits and Devices.

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