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Electronics production defects and a...

Thomas, Oommen Tharakan Kuttiyil.

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Electronics production defects and analysis

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Electronics production defects and analysis/ by Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan.
作者:	Thomas, Oommen Tharakan Kuttiyil.
其他作者:	Gopalan, Padma Padmanabhan.
出版者:	Singapore :Springer Singapore : : 2022.,
面頁冊數:	xxi, 140 p. :ill. (chiefly col.), digital ;24 cm.
內容註:	Chapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout.
Contained By:	Springer Nature eBook
標題:	Electronic apparatus and appliances - Design and construction. -
電子資源:	https://doi.org/10.1007/978-981-16-9824-8
ISBN:	9789811698248

Electronics production defects and analysis
Thomas, Oommen Tharakan Kuttiyil.

Electronics production defects and analysis[electronic resource] /by Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan. - Singapore :Springer Singapore :2022. - xxi, 140 p. :ill. (chiefly col.), digital ;24 cm. - Springer tracts in electrical and electronics engineering,2731-4219. - Springer tracts in electrical and electronics engineering..

Chapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout.

This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.

ISBN: 9789811698248

Standard No.: 10.1007/978-981-16-9824-8doiSubjects--Topical Terms:

631277
Electronic apparatus and appliances
--Design and construction.

LC Class. No.: TK7870 / .T56 2022

Dewey Class. No.: 621.381

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520 $a This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
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