Lau, John H.
概要
| 作品: | 1 作品在 8 項出版品 2 種語言 | |
|---|---|---|
書目資訊
Assembly and reliability of lead-free solder joints
by:
Lau, John H.; Lee, Ning-Cheng.; SpringerLink (Online service)
(書目-電子資源)
Flip chip, hybrid bonding, fan-in, and fan-out technology
by:
Lau, John H.; SpringerLink (Online service)
(書目-電子資源)
Microvias = for low cost, high density interconnects /
by:
Lee, S. W. Ricky.; NetLibrary, Inc.; Lau, John H.
(書目-語言資料,印刷品)
Chiplet design and heterogeneous integration packaging
by:
Lau, John H.; SpringerLink (Online service)
(書目-電子資源)
主題
Semiconductors.
Laser Technology.
Solder and soldering.
Joints (Engineering)
Microelectromechanical systems.
Interconnects (Integrated circuit technology)
Electronic Devices.
Electronics and Microelectronics, Instrumentation.
Semiconductors- Design and construction.
Microsystems and MEMS.
Printed circuits.
Circuits and Systems.
Integrated circuits- Design and construction.
Optics and Photonics.
電路
Semiconductors- Junctions.
Chip scale packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Engineering.
Optical and Electronic Materials.
Electronic Circuits and Systems.
Integrated circuits- Design and construction
Integrated circuits.
Electronic Circuits and Devices.
Industrial and Production Engineering.