Schambeck, Simon.
Overview
| Works: | 4 works in 0 publications in 0 languages | |
|---|---|---|
Titles
Einfluss der Temperaturwechselbedingungen auf Fehlermechanismus und Lebensdauer von SnAgCu Lotverbindungen = = The Influence of Temperature Cycle Conditions on the Failure Mechanism and the Lifetime of Snagcu Solder Joints.
by:
Schambeck, Simon.; ProQuest Information and Learning Co.; Technische Universitaet Berlin (Germany).
(Electronic resources)