語系
Gan, Chong Leong.
概要
| 作品: | 1 作品在 2 項出版品 1 種語言 | |
|---|---|---|
書目資訊
Interconnect reliability in advanced memory device packaging
by:
Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service)
(書目-電子資源)
Electronic materials innovations and reliability in advanced memory packaging
by:
Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service)
(書目-電子資源)
主題
Electronics Design and Verification.
Interconnects (Integrated circuit technology)- Reliability.
Materials Engineering.
Computer storage devices- Packaging.
Electronic Circuits and Systems.
Hardware Performance and Reliability.
Electronic packaging- Materials.
Electronic Materials.
Industrial and Production Engineering.