語系
Siow, Kim S.
概要
作品: | 4 作品在 1 項出版品 1 種語言 |
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書目資訊
Die-attach materials for high temperature applications in microelectronics packaging = materials, processes, equipment, and reliability /
by:
Siow, Kim S.; SpringerLink (Online service)
(書目-電子資源)