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Zhang, Qingke.

Overview

Works:	2 works in 1 publications in 1 languages

Titles

Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces by: Zhang, Qingke.; SpringerLink (Online service) (Electronic resources)

Subjects

Mechanics. Lead-free electronics manufacturing processes- Research. Surfaces and Interfaces, Thin Films. Electronics- Materials. Engineering. Structural Mechanics. Characterization and Evaluation of Materials. Solder and soldering- Design and construction.

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