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Ye, Hua.

概要

作品:	2 作品在 1 項出版品 1 種語言

書目資訊

Mechanical behavior of microelectronics and power electronics solder joints under high current density: Analytical modeling and experimental investigation. by: Ye, Hua.; State University of New York at Buffalo. (書目-電子資源)

Spectral discretization-based eigen-analysis of time-delay systems = numerical methods and scalable applications / by: Ye, Hua.; Liu, Yutian.; Jia, Xiaofan.; SpringerLink (Online service) (書目-電子資源)

主題

Applications of Mathematics. Engineering, Mechanical. Time delay systems- Mathematical models. Electrical and Electronic Engineering. Energy Policy, Economics and Management. Electrical Power Engineering. Engineering, Civil. Engineering, Electronics and Electrical. Eigenvalues.

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