Liu, Yong.
概要
作品: | 1 作品在 11 項出版品 1 種語言 |
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書目資訊
Current geotechnical engineering aspects of civil infrastructures = poceedings of the 5th GeoChina International Conference 2018 - Civil Infrastructures Confronting Severe Weathers and Climate Changes: From Failure to Sustainability, held on July 23 to 25, 2018 in HangZhou, China /
by:
Geo-China International Conference (2018 :); Weng, Meng-Chia.; Lee, Jeffrey.; Liu, Yong.; SpringerLink (Online service)
(書目-電子資源)
Advances in natural computation, fuzzy systems and knowledge discover.. Volume 1
by:
Liu, Yong.; SpringerLink (Online service); International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (2019 :)
(書目-電子資源)
Advances in innovative geotechnical engineering = proceedings of the 6th GeoChina International Conference on Civil & Transportation Infrastructures: from engineering to smart & green life cycle solutions - Nanchang, China, 2021 /
by:
Liu, Yong.; Yang, Junsheng.; SpringerLink (Online service); GeoChina International Conference (2021 :); Cuomo, Sabatino.
(書目-電子資源)
Value in business = a holistic, systems-based approach to creating and achieving value /
by:
Liu, Yong.; SpringerLink (Online service); Forrest, Jeffrey Yi-Lin.
(書目-電子資源)
Passive and active measurement = 16th International Conference, PAM 2015, New York, NY, USA, March 19-20, 2015 : proceedings /
by:
Liu, Yong.; SpringerLink (Online service); Mirkovic, Jelena.
(書目-電子資源)
Essays on competitive strategies in the broadcasting television industry.
by:
Liu, Yong.; The University of British Columbia (Canada).
(書目-語言資料,印刷品)
Wafer-level chip-scale packaging = analog and power semiconductor applications /
by:
Liu, Yong.; SpringerLink (Online service); Qu, Shichun.
(書目-電子資源)
Intelligence computation and applications = 14th International Symposium, ISICA 2023, Guangzhou, China, November 18-19, 2023 : revised selected papers.. Part I /
by:
Liu, Yong.; SpringerLink (Online service); Li, Kangshun.; ISICA (Symposium) (2023 :)
(書目-電子資源)
Intelligence computation and applications = 14th International Symposium, ISICA 2023, Guangzhou, China, November 18-19, 2023 : revised selected papers.. Part II /
by:
Liu, Yong.; SpringerLink (Online service); ISICA (Symposium) (2023 :); Li, Kangshun.
(書目-電子資源)
Pricing and resource allocation in communication networks and supply chains.
by:
Liu, Yong.; Boston University.
(書目-語言資料,印刷品)
CMOS magnetic cell manipulator and CMOS NMR biomolecular sensor.
by:
Liu, Yong.; Harvard University.
(書目-語言資料,印刷品)
Supply chain management through price commitment policies.
by:
Liu, Yong.; University of Cincinnati.
(書目-電子資源)
Exploration of novel intelligent optimization algorithms = 12th International Symposium, ISICA 2021, Guangzhou, China, November 20-21, 2021 : revised selected papers /
by:
Liu, Yong.; SpringerLink (Online service); ISICA (Symposium) (2021 :); Wang, Wenxiang.; Li, Kangshun.
(書目-電子資源)
Modeling and simulation of methane production from hydrate reserves.
by:
Illinois Institute of Technology.; Liu, Yong.
(書目-電子資源)
Evolvable systems = from biology to hardware : 4th International Conference, ICES 2001, Tokyo, Japan, October3-5, 2001 : proceedings /
by:
Liu, Yong.; SpringerLink (Online service); International Conference on Evolvable Systems (2001 :)
(書目-語言資料,印刷品)
Subpixel detection of 3D objects in hyperspectral imagery.
by:
Liu, Yong.; University of California, Irvine.
(書目-電子資源)
Multiscale approach to optimal control of in situ bioremediation of groundwater.
by:
Liu, Yong.; University of Illinois at Urbana-Champaign.
(書目-語言資料,印刷品)
Advances in natural computation, fuzzy systems and knowledge discovery.. Volume 2
by:
Liu, Yong.; SpringerLink (Online service); International Conference on Natural Computation, Fuzzy Systems and Knowledge Discovery (2019 :)
(書目-電子資源)
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Business Administration, Marketing.
3-D films- History and criticism.
Film/TV Technology.
Earth Sciences.
Organization.
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Cinematography.
Cultural and Media Studies.
American Cinema.
Natural computation
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Supply and demand.
Mathematics of Computing.
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Digital integrated circuits- Design and construction
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Electronics and Microelectronics, Instrumentation.
Information Systems Applications (incl. Internet)
Civil engineering- Environmental aspects
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Geotechnical Engineering & Applied Earth Sciences.
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Geotechnical engineering
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Chip scale packaging.
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