Wire bonding (Electronic packaging)

Force Sensors for Microelectronic Packaging Applications by: (Language materials, printed)

Hot Cracking Phenomena in Welds by: (Language materials, printed)

Copper wire bonding by: (Electronic resources)

Chemistry.

Mechatronics.

Wire bonding (Electronic packaging)

Nanotechnology.

Operating Procedures, Materials Treatment.

Electronics and Microelectronics, Instrumentation.

Copper wire.

Continuum Mechanics and Mechanics of Materials.

Metallic Materials.

Microelectronic packaging.

Optical and Electronic Materials.

Physics and Applied Physics in Engineering.

Engineering.

Quality Control, Reliability, Safety and Risk.