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Wire bonding (Electronic packaging)
概要
作品:
3 作品在 1 項出版品 1 種語言
書目資訊
Force Sensors for Microelectronic Packaging Applications
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(書目-語言資料,印刷品)
Hot Cracking Phenomena in Welds
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(書目-語言資料,印刷品)
Copper wire bonding
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(書目-電子資源)
主題
Chemistry.
Mechatronics.
Wire bonding (Electronic packaging)
Nanotechnology.
Operating Procedures, Materials Treatment.
Electronics and Microelectronics, Instrumentation.
Copper wire.
Continuum Mechanics and Mechanics of Materials.
Metallic Materials.
Microelectronic packaging.
Optical and Electronic Materials.
Physics and Applied Physics in Engineering.
Engineering.
Quality Control, Reliability, Safety and Risk.
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