Lin, Ta-Hsuan.
概要
| 作品: | 2 作品在 0 項出版品 0 種語言 | |
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書目資訊
Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology.
by:
Lin, Ta-Hsuan.; State University of New York at Binghamton., Systems Science.
(書目-電子資源)